This is early beta for now! Can't handle all templates properly
Hankkija
| Vastaanotettu Hilmaan | 2023-05-17 |
| Ilmoituksen numero | 2023-128903 |
| TED numero | 2023/S 097-303833 |
| Ostajaorganisaatio | VTT Technical Research Centre of Finland Ltd (2647375-4 ) P.O. Box 1000, VTT FI-02044 Espoo https://www.vttresearch.com/en |
| Hankinnan otsikkotiedot | Si & Silicon oxide CMP |
| Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) arvio | 800 000 EUR |
| Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) lopullinen | |
| Alkuperäinen ilmoitus | https://www.hankintailmoitukset.fi/en/public/procurement/88362/notice/128903/overview |
| Originaali JSON tietue | 128903.json |
Ostettava
| Hankinnan lyhyt kuvaus | The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si, Si-compounds, Ge and other typical wafers used in semiconductor industry of 100, 150 and 200mm diameter. The equipment shall be designed with at least two polishing platens with integrated in-situ capable pad conditioning systems, an end-point detection on at least one platen, multi-zone carrier heads for all wafer diameters and a slurry feed system for at least 3 slurries. In addition, a supporting wafer cleaning system either integrated or stand-alone is an optional part of the tendering procedure. The tool must comply with cleanroom equipment standard safety and contamination requirements. The tool specs are based on the following factors: - Polish finishing quality - Wafer handling without errors and wafer loss - End-point detection for layer clearing - Achievable polishing rate profile The pricing of the equipment will consist of the main price for the minimum tool requirements (“total price of the equipment”) and a separate price for the optional parts, features and efforts. The optional goods offered are not included in the total price of the equipment. The object of the tender process is described in more detail in the invitation to tender documents. |
| Hankintanimikkeistö (CPV) pää | Miscellaneous general and special-purpose machinery (42900000) |
| Hankintanimikkeistö (CPV) muut | |
| Aluekoodi | FI1B |
| Pääasiallinen suorituspaikka |
