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Vastaanotettu Hilmaan	2023-10-03
Ilmoituksen numero	2023-137694
TED numero	2023/S 193-604710
Ostajaorganisaatio	VTT Technical Research Centre of Finland Ltd (2647375-4 ) P.O. Box 1000, VTT FI-02044 Espoo https://www.vttresearch.com/en
Hankinnan otsikkotiedot	Si & Silicon oxide CMP
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) arvio	868 626 EUR
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) lopullinen	868 626 EUR
Alkuperäinen ilmoitus	https://www.hankintailmoitukset.fi/fi/public/procurement/88362/notice/137694/overview
Originaali JSON tietue	137694.json

Hankinnan lyhyt kuvaus	The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si, Si-compounds, Ge and other typical wafers used in semiconductor industry of 100, 150 and 200mm diameter. The equipment shall be designed with at least two polishing platens with integrated in-situ capable pad conditioning systems, an end-point detection on at least one platen, multi-zone carrier heads for all wafer diameters and a slurry feed system for at least 3 slurries. In addition, a supporting wafer cleaning system either integrated or stand-alone is an optional part of the tendering procedure. The object of the tender process is described in more detail in the invitation to tender documents.
Hankintanimikkeistö (CPV) pää	Miscellaneous general and special-purpose machinery (42900000)
Hankintanimikkeistö (CPV) muut
Aluekoodi	FI1B
Pääasiallinen suorituspaikka

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