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Hankkija

Vastaanotettu Hilmaan2023-09-06
Ilmoituksen numero2023-136021
TED numero2023/S 174-546277
OstajaorganisaatioVTT Technical Research Centre of Finland Ltd (2647375-4 )
P.O. Box 1000, VTT
FI-02044 Espoo
https://www.vttresearch.com/en
Hankinnan otsikkotiedotAUTOMATIC WAFER GRINDER
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) arvio
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) lopullinen739 030 EUR
Alkuperäinen ilmoitushttps://www.hankintailmoitukset.fi/fi/public/procurement/85977/notice/136021/overview
Originaali JSON tietue136021.json

Ostettava

Hankinnan lyhyt kuvausThe object of the tender was an Automatic Wafer Grinder (later also “Equipment”), capable of thinning Si and SiC, LiNbO3 wafers of 100, 150 and 200mm diameter to varying thicknesses with end-point control, cassette-to-cassette processing, TTV profile control and capability to handle thin wafers 100um thick supported by tape and grind away bonded wafer stacks to within 3 um of a typical interface. The technical specification of the equipment to be supplied was discussed in more detail in Annex 1. The objective was to find one professional supplier that can guarantee a high standard of quality and who is capable of providing the Automatic Wafer Grinder, installation, and user training in its entirety. VTT Technical Research Centre of Finland Ltd will choose one supplier from among the tenderers.
Hankintanimikkeistö (CPV) pääMiscellaneous general and special-purpose machinery (42900000)
Hankintanimikkeistö (CPV) muut
AluekoodiFI1
Pääasiallinen suorituspaikka

Sopimukset

Päätös päivämäärä2023-06-19
Sopimusnumero
MyyjätDISCO HI-TEC EUROPE GmbH (DE)