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Hankkija
Vastaanotettu Hilmaan | 2022-04-27 |
Ilmoituksen numero | 2022-099541 |
TED numero | 2022/S 085-229095 |
Ostajaorganisaatio | VTT Technical Research Centre of Finland Ltd (2647375-4 ) P.O. Box 1000, VTT FI-02044 Espoo https://www.vttresearch.com/en |
Hankinnan otsikkotiedot | SUB MICRON ACCURAY FLIP CHIP DIE BONDE FOR RESEARCH AND SMALL VOLUME PRODUCTION |
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) arvio | |
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) lopullinen | |
Alkuperäinen ilmoitus | https://www.hankintailmoitukset.fi/en/public/procurement/69696/notice/99541/overview |
Originaali JSON tietue | 99541.json |
Ostettava
Hankinnan lyhyt kuvaus | The object of the tender process is a manual of semiautomatic flip chip die bonder with high placement accuracy and flexibility to different bonding technologies (later also “Equipment”). Main use is research and low volume bonding. Bonder must be able to handle wide scale of different chip sizes and capability to accurately control bond force. Accuracy should targeted below 1 um and advanced alignment features are key parameters. Besides of normal pad alignment also alignment to features around bonded die are required. Main applications are thermocompression flip chip bonding, soldering BGA components and eutectic AuSn soldering and sealing. Different configurations could be implemented with user changeable modules. The object of the tender process is described in more detail in the invitation to tender documents. |
Hankintanimikkeistö (CPV) pää | Miscellaneous special-purpose machinery (42990000) |
Hankintanimikkeistö (CPV) muut | |
Aluekoodi | FI |
Pääasiallinen suorituspaikka |