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Hankkija

Vastaanotettu Hilmaan2022-04-27
Ilmoituksen numero2022-099541
TED numero2022/S 085-229095
OstajaorganisaatioVTT Technical Research Centre of Finland Ltd (2647375-4 )
P.O. Box 1000, VTT
FI-02044 Espoo
https://www.vttresearch.com/en
Hankinnan otsikkotiedotSUB MICRON ACCURAY FLIP CHIP DIE BONDE FOR RESEARCH AND SMALL VOLUME PRODUCTION
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) arvio
Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) lopullinen
Alkuperäinen ilmoitushttps://www.hankintailmoitukset.fi/en/public/procurement/69696/notice/99541/overview
Originaali JSON tietue99541.json

Ostettava

Hankinnan lyhyt kuvausThe object of the tender process is a manual of semiautomatic flip chip die bonder with high placement accuracy and flexibility to different bonding technologies (later also “Equipment”). Main use is research and low volume bonding. Bonder must be able to handle wide scale of different chip sizes and capability to accurately control bond force. Accuracy should targeted below 1 um and advanced alignment features are key parameters. Besides of normal pad alignment also alignment to features around bonded die are required. Main applications are thermocompression flip chip bonding, soldering BGA components and eutectic AuSn soldering and sealing. Different configurations could be implemented with user changeable modules. The object of the tender process is described in more detail in the invitation to tender documents.
Hankintanimikkeistö (CPV) pääMiscellaneous special-purpose machinery (42990000)
Hankintanimikkeistö (CPV) muut
AluekoodiFI
Pääasiallinen suorituspaikka

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