This is early beta for now! Can't handle all templates properly
Hankkija
| Vastaanotettu Hilmaan | 2021-06-23 |
| Ilmoituksen numero | 2021-077639 |
| TED numero | 2021/S 126-330956 |
| Ostajaorganisaatio | Teknologian tutkimuskeskus VTT Oy (2647375-4 ) P.O. Box 1000, VTT FI-02044 Espoo http://www.vttresearch.com/en |
| Hankinnan otsikkotiedot | Market survey: Contact Lithography Automated Mask Aligner |
| Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) arvio | |
| Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) lopullinen | |
| Alkuperäinen ilmoitus | https://www.hankintailmoitukset.fi/en/public/procurement/55619/notice/77639/overview |
| Originaali JSON tietue | 77639.json |
Ostettava
| Hankinnan lyhyt kuvaus | The object of the information request is a fully automated mask aligner used to UV expose photoresist coated wafers in order to transfer the mask image 1:1 onto the photoresist. The mask aligner must be able to process wafers of 8inch diameter SEMI standard of various thicknesses and transparency. The handling of the wafers within the tool is cassette to cassette mode, with an option for an additional cassette/port for the rejected wafers. Error-free wafer handling in both standard handling and edge handling is required. The tool needs to have a wafer prealigner. Touch screen with a user friendly UI, ergonomic keyboard, and tool setup (for example the position of the loadports) are needed. A mask library inside the tool is an option. The tool is enclosed in a frame. The tool must comply with the cleanroom equipment standard safety requirements. The maximum size of the equipment including the maintenance area is 1800mm x 1300mm x 3500 mm (L x W x H). Some key features we expect to have: Wafer size and other material characteristics • Silicon or glass (fully or partially transparent) wafers, SSP or DSP, CMOS compatible. The wafers have one or multiple layers including photoresist. • Wafer diameter: 8inch (equivalent to 200mm) • Wafer thickness range: 200µm -1300µm • The 200mm wafers have a SEMI standard notch size which is used in prealignment. The tool has to be able to process wafers with a SEMI standard minor flat. • Allowed wafer warpage/bow up to 150um. • Photomask size of 9inch. Operation requirements • LED exposure system (365 nm and optional 405+435 nm light wavelength) with possibility of precise wavelength configurations through software. • Both contact and non-contact (possibly laser measured) WEC system • Edge handling chuck for 8inch wafers, with edge exclusion of 5-7mm. • Edge handling robot arm for 8inch wafers. • Angle configurable flat/notch aligner with edge contact for 8inch wafers. • Changeable mask holder with an option of avoiding hand touch of the mask. • Topside or Backside IR alignment additionally to the optical alignment standard method. Software • PC OS: Linux or Windows10 at least (or other sustainable OS with a lifespan of min. 10 years) • Easy recipe writing from a scratch. Simple recipe management environment. • Possibility to choose random wafer from the cassette for exposure, not all present wafers in the cassette Hardware • All parts coming in contact with the wafers must be CMOS compatible. Materials transfer analysis will be conducted. • Internal shelf for masks storage (non-automated, masks manually picked up) • Cassette mapping for assessing the correct position of the wafers in the cassette slots. • Anti-vibration table/chuck system (insulation from mechanical vibrations, shock absorbers) • All tool materials must be cleanroom compatible class ISO 4 or cleaner • Configurable signal light tower • Interlock bypass possibility without tool being set for service and maintenance. • Prealigner type - edge gripping only • Hotplate module enclosed within the tool frame – optional feature. Performance • Light beam uniformity • Prealigner linear accuracy (X and Y) • Topside alignment accuracy • Backside alignment accuracy • Overlay accuracy • First layer wafer centering accuracy on the chuck • Wafer pre-alignment accuracy for subsequent layers • Resolution • Real time picture with automatic pattern recognition for alignment marks, auto alignment, automatic cross correction (when the image of the cross is not good enough, bad quality of the cross will be enhanced to make alignment possible). • Backside optics enhanced travel range - to the edge of the wafer sized 200mm. • Large gap optics to have higher depth of focus. |
| Hankintanimikkeistö (CPV) pää | |
| Hankintanimikkeistö (CPV) muut | |
| Aluekoodi | FI1B |
| Pääasiallinen suorituspaikka |
Sopimukset
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