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Hankkija
| Vastaanotettu Hilmaan | 2019-12-31 |
| Ilmoituksen numero | 2018-023941 |
| TED numero | 2018/S 226-516433 |
| Ostajaorganisaatio | TTY-säätiö sr (2286106-3 ) Korkeakoulunkatu 10 FI-33720 Tampere http://www.tut.fi |
| Hankinnan otsikkotiedot | PRIOR INFORMATION NOTICE: Bonder and Alignment System for MEMS and Microfluidics |
| Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) arvio | |
| Hankinnan yhteenlaskettu kokonaisarvo koko ajalle (ilman alv:ta) lopullinen | |
| Alkuperäinen ilmoitus | https://www.hankintailmoitukset.fi/en/public/procurement/11851/notice/13587/overview |
| Originaali JSON tietue | 13587.json |
Ostettava
| Hankinnan lyhyt kuvaus | The Centre of Excellence in Body-on-Chip research consortium develops polymer and glass based microfluidic systems and sensors for cell applications (https://www.bodyonchip.fi/). The laboratory of Photonics (http://www.tut.fi/en/research/research-fields/photonics/index.htm) develops temporary and permanent bonding processes between III-V or Ge wafers and III-V wafers, SiC, Si or glass substrates. Procurement includes R&D level equipment for building these systems. Desired features for the equipment will be aligning and bonding wafers with direct and anodic bonding. Equipment should be also suitable for a hot-embossing processes. Equipment should have option for plasma activated bonding and other bonding methods. Applications mainly on 4” or smaller round or rectangular wafers or wafer fragments. Example application: hot-embossing microfluidic channels on polymer wafers and closing channels by bonding wafers together by direct bonding. |
| Hankintanimikkeistö (CPV) pää | |
| Hankintanimikkeistö (CPV) muut | |
| Aluekoodi | FI197 |
| Pääasiallinen suorituspaikka |
Sopimukset
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