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"The object of the information request is a fully\u202fautomated\u202fmask aligner\u202fused to UV expose photoresist coated wafers in order to transfer the mask image\u202f1:1 onto the photoresist.\u202f",
"",
"The mask aligner\u202fmust\u202fbe able to process wafers of 8inch diameter SEMI standard of various thicknesses and transparency.\u202f",
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"The handling of the wafers within the tool is cassette to cassette mode,\u202fwith an option for an additional cassette\/port for the rejected wafers.\u202fError-free wafer handling in both standard handling and edge handling\u202fis required.\u202fThe tool needs to have a\u202fwafer prealigner.\u202f",
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"\u2022\tAllowed wafer warpage\/bow up to 150um. ",
"\u2022\tPhotomask size of 9inch.\u202f ",
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"\u2022\tLED exposure system (365 nm and optional 405+435 nm light wavelength)\u202fwith\u202fpossibility of precise\u202fwavelength configurations through software.\u202f ",
"\u2022\tBoth contact and non-contact (possibly laser measured) WEC system ",
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"\u2022\tEdge handling robot arm for 8inch wafers. ",
"\u2022\tAngle configurable flat\/notch aligner with edge contact\u202ffor 8inch wafers.\u202f ",
"\u2022\tChangeable mask holder\u202fwith an option of avoiding hand touch of the mask.\u202f ",
"\u2022\tTopside\u202for Backside\u202fIR alignment additionally to the optical alignment standard method.\u202f\u202f ",
"",
"Software\u202f\u202f ",
"\u2022\tPC OS: Linux or Windows10 at least (or other sustainable OS with a lifespan of min. 10 years) ",
"\u2022\tEasy recipe writing from a scratch. Simple recipe management environment. ",
"\u2022\tPossibility to choose random wafer from the cassette for exposure, not all present wafers in the cassette ",
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"\u2022\tInternal shelf for masks storage (non-automated, masks manually picked up) ",
"\u2022\tCassette mapping for assessing the correct position of the wafers in the cassette slots. ",
"\u2022\tAnti-vibration table\/chuck\u202fsystem (insulation from mechanical vibrations, shock absorbers)\u202f ",
"\u2022\tAll\u202ftool\u202fmaterials must be cleanroom compatible class ISO 4\u202for cleaner ",
"\u2022\tConfigurable signal\u202flight\u202ftower\u202f ",
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"\u2022\tPrealigner\u202ftype - edge gripping only ",
"\u2022\tHotplate module enclosed within the tool frame \u2013 optional feature. ",
"\u202f ",
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"\u2022\tLight\u202fbeam\u202funiformity",
"\u2022\tPrealigner linear accuracy (X and Y) ",
"\u2022\tTopside alignment accuracy ",
"\u2022\tBackside alignment accuracy ",
"\u2022\tOverlay accuracy ",
"\u2022\tFirst layer wafer centering accuracy on the chuck \u202f ",
"\u2022\tWafer pre-alignment accuracy for subsequent layers ",
"\u2022\tResolution ",
"\u2022\tReal time picture with automatic pattern recognition for alignment marks,\u202fauto alignment,\u202fautomatic cross correction (when the image of the cross is not good enough, bad quality of the cross will be enhanced to make alignment possible).\u202f ",
"\u2022\tBackside optics enhanced travel range - to the edge of the wafer sized 200mm.\u202f ",
"\u2022\tLarge gap\u202foptics to have higher depth of focus."
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"In case you are a supplier of the equipment described in this information request, please send your answer with requested information by e-mail to Olga Mihailichenco, [email protected] by 12pm (Finnish time) 30 July 2021.",
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