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"A high-performance sputtering tool is required, which is able to deposit the most demanding thin films with industrial quality standard, but which is at the same time very versatile and modifiable. It must provide simultaneously a large number (10) of target positions, RF, DC, co-sputtering, etching, simultaneous handling of two wafer sizes (150\/200mm) without wafer carriers, separated IC\/non-IC material processing, and leaving room for future expansion, thus maintaining exceptional quality and flexibility for research at the VTT Micronova cleanroom facility.",
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